Novel silicon chip allowing terahertz waves to pass through barriers could enable future 6G networks

Researchers at JNCASR developed a silicon chip enabling terahertz waves to pass through engineered barriers for 6G networks at 100 Gbit/s.

• The chip was fabricated on high-resistivity silicon compatible with semiconductor manufacturing.
• A single barrier caused only 1-2% loss and two barriers caused 2-3% loss.
• The study was led by Dr Abhishek Kumar and published in Advanced Materials.
• Devices tested included a double-barrier, an omega-shaped route with four sharp bends, and a power splitter.